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Standard PDMS microfluidic chip -
Standard PDMS microfluidic chip
Standard PSMS microfluidic chips include: single chip, cross chip, T chip, Y chip, focus chip and S hybrid chip.Standard PDMS chipOptionally bonded blank layers are PDMS (3-4mm) and slides (0.17mm, 0.
Standard PSMS microfluidic chips include: single chip, cross chip, T chip, Y chip, focus chip and S hybrid chip.
Standard PDMS chip
Optionally bonded blank layers are PDMS (3-4mm) and slides (0.17mm, 0.55mm, 1mm).
Chip thickness: 3-5mm runner layer.
Ordering options
Type | Material | Material no. | Model |
Single chip | PDMS | 3.2.002.00.001 | Pdms-pdms bond, depth 50um, line width 50um |
Single chip | PDMS | 3.2.002.00.002 | PDMS- slide bonding, depth 50um, line width 50um |
Single chip | PDMS | 3.2.002.00.003 | Pdms-pdms bond, depth 50um, line width 100um |
Single chip | PDMS | 3.2.002.00.004 | Pdms-slide bonding, 50um depth, 100um linewidth |
Single chip | PDMS | 3.2.002.00.005 | Pdms-pdms bond, depth 50um, line width 150um |
Single chip | PDMS | 3.2.002.00.006 | Pdms-slide bonding, 50um depth, 150um linewidth |
Single chip | PDMS | 3.2.002.00.007 | Pdms-pdms bond, depth 50um, line width 200um |
Single chip | PDMS | 3.2.002.00.008 | Pdms-slide bonding, 50um depth, 200um linewidth |
Cross chip | PDMS | 3.2.002.00.009 | Pdms-pdms bond, depth 50um, line width 50um |
Cross chip | PDMS | 3.2.002.00.010 | PDMS- slide bonding, depth 50um, line width 50um |
Cross chip | PDMS | 3.2.002.00.011 | Pdms-pdms bond, depth 50um, line width 100um |
Cross chip | PDMS | 3.2.002.00.012 | Pdms-slide bonding, 50um depth, 100um linewidth |
Cross chip | PDMS | 3.2.002.00.013 | Pdms-pdms bond, depth 50um, line width 150um |
Cross chip | PDMS | 3.2.002.00.014 | Pdms-slide bonding, 50um depth, 150um linewidth |
Cross chip | PDMS | 3.2.002.00.015 | Pdms-pdms bond, depth 50um, line width 200um |
Cross chip | PDMS | 3.2.002.00.016 | Pdms-slide bonding, 50um depth, 200um linewidth |
Y chip | PDMS | 3.2.002.00.017 | Pdms-pdms bond, depth 50um, line width 50um |
Y chip | PDMS | 3.2.002.00.018 | PDMS- slide bonding, depth 50um, line width 50um |
Y chip | PDMS | 3.2.002.00.019 | Pdms-pdms bond, depth 50um, line width 100um |
Y chip | PDMS | 3.2.002.00.020 | Pdms-slide bonding, 50um depth, 100um linewidth |
Y chip | PDMS | 3.2.002.00.021 | Pdms-pdms bond, depth 50um, line width 150um |
Y chip | PDMS | 3.2.002.00.022 | Pdms-slide bonding, 50um depth, 150um linewidth |
Y chip | PDMS | 3.2.002.00.023 | Pdms-pdms bond, depth 50um, line width 200um |
Y chip | PDMS | 3.2.002.00.024 | Pdms-slide bonding, 50um depth, 200um linewidth |
T-shaped chip | PDMS | 3.2.002.00.025 | Pdms-pdms bond, depth 50um, line width 50um |
T-shaped chip | PDMS | 3.2.002.00.026 | PDMS- slide bonding, depth 50um, line width 50um |
T-shaped chip | PDMS | 3.2.002.00.027 | Pdms-pdms bond, depth 50um, line width 100um |
T-shaped chip | PDMS | 3.2.002.00.028 | Pdms-slide bonding, 50um depth, 100um linewidth |
T-shaped chip | PDMS | 3.2.002.00.029 | Pdms-pdms bond, depth 50um, line width 150um |
T-shaped chip | PDMS | 3.2.002.00.030 | Pdms-slide bonding, 50um depth, 150um linewidth |
T-shaped chip | PDMS | 3.2.002.00.031 | Pdms-pdms bond, depth 50um, line width 200um |
T-shaped chip | PDMS | 3.2.002.00.032 | Pdms-slide bonding, 50um depth, 200um linewidth |
Focusing chip | PDMS | 3.2.002.00.033 | Pdms-pdms bond, depth 50um, line width 50um |
Focusing chip | PDMS | 3.2.002.00.034 | PDMS- slide bonding, depth 50um, line width 50um |
Focusing chip | PDMS | 3.2.002.00.035 | Pdms-pdms bond, depth 50um, line width 100um |
Focusing chip | PDMS | 3.2.002.00.036 | Pdms-slide bonding, 50um depth, 100um linewidth |
Focusing chip | PDMS | 3.2.002.00.037 | Pdms-pdms bond, depth 50um, line width 150um |
Focusing chip | PDMS | 3.2.002.00.038 | Pdms-slide bonding, 50um depth, 150um linewidth |
Focusing chip | PDMS | 3.2.002.00.039 | Pdms-pdms bond, depth 50um, line width 200um |
Focusing chip | PDMS | 3.2.002.00.040 | Pdms-slide bonding, 50um depth, 200um linewidth |
S hybrid chip | PDMS | 3.2.002.00.041 | Pdms-pdms bond, depth 50um, line width 100um |
S hybrid chip | PDMS | 3.2.002.00.042 | Pdms-slide bonding, 50um depth, 100um linewidth |
S hybrid chip | PDMS | 3.2.002.00.043 | Pdms-pdms bond with depth of 50um, line width of 300um |
S hybrid chip | PDMS | 3.2.002.00.044 | Pdms-slide bonding, 50um depth, 300um linewidth |
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